Flex Circuit Board

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Product Description

Flex Circuit Board is a revolutionary innovation in circuit board technology. As the name implies, it's a printed circuit board that has been designed to flex, bend and twist without breaking or losing its shape. This flexibility makes it perfect for use in devices that require design adjustments to function correctly.

The Flex Circuit Board is manufactured using high-quality materials that make it highly durable and resilient. It can withstand mechanical, thermal and chemical stress, which makes it the perfect solution for tough environments. The circuit board can also handle high-frequency signals and can be used in a wide range of applications like consumer electronic devices, aerospace, military, and medical devices.

The Flex Circuit Board is incredibly thin, which makes it suitable for use in devices that require compact designs. It is also lightweight, which reduces the overall weight of the device, making it easier to carry around. Flex Circuit Board is highly customizable, with options such as single-sided, double-sided, multi-layered, and rigid-flexible combination options.

The 4-layer PCB provided by Hoshineo Lcd-Tech, that is, the four-layer Printed Circuit Board (PCB), is made of four layers of glass fiber or other insulating materials, and these layers are connected through conductive channels. It typically consists of a top layer, two inner layers, and a bottom layer for routing electrical signals and connecting electronic components.

Hoshineo Lcd-Tech 4-layer PCB specification :

Layer Count(L)	4 Layers	Copper Thickness(OZ)	140um(4OZ）
Production Panel Size(mm)	≤483*623mm	Line Width/Space	3/3mil
Core Thickness(mm)	0.05	Hole Plating Aspect Ratio AR	≤10:1
Dielectrict Thickness(mm)	≧0.005	Warpage	0.60%
BGA Pad Pitch(mm)	≧0.4	SMT Pitch (mm)	≧0.5
Solder Mask Regisvation(mm)	±0.038	Impedance Controltolerance	±8%
Inner Layer Clearance	≧20 µm	Surface Treatment	HASL(lead and lead free),Plating/ENIG,OSP

Hoshineo Lcd-Tech 4-layer PCB Product Features and functions

Laminated structure: A typical 4-layer PCB stack structure includes a top signal layer, an inner layer 1, an inner layer 2, and a bottom signal layer. This structure provides more flexibility and complexity in circuit design.

Conductive channel: Through the hole to connect different layers of the circuit to achieve signal transmission and component interconnection.

Material selection: Glass fiber or other insulating materials are usually used as the substrate, and the surface is covered with copper foil for wiring.

Signal transmission: The main function of the 4-layer PCB is to act as a medium for signal transmission between electronic components, and connect the various components through wiring to achieve the function of the circuit.

Power distribution: The inner layer can be used as a power layer (VCC) to provide a stable power supply to the circuit.

Ground protection: The inner layer can also act as a ground layer (GND), providing ground protection for the circuit, stabilizing the signal and preventing interference.